Integrated circuit package system with offset stacking
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Linda Pei Ee Chua, Heap Hoe Kuan
Life of this patent
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Abstract
An integrated circuit package system includes: providing an interposer having a bond pad and a contact pad; mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier; connecting an electrical interconnect between bond pad and the carrier; and forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered.
Claims20
An integrated circuit package system comprising:
- providing an interposer having a bond pad and a contact pad;
- mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier;
- connecting an electrical interconnect between bond pad and the carrier;
- and
- forming a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered.
An integrated circuit package system comprising:
- providing an interposer having a bond pad and a contact pad;
- mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier;
- mounting a first integrated circuit device over the carrier;
- mounting a passive device over the carrier;
- connecting an electrical interconnect between bond pad and the carrier;
- and
- forming a package encapsulation over the carrier, the electrical interconnect, the passive device, and the first integrated circuit device with both the contact pad and the exposed side of the interposer not covered.
An integrated circuit package system comprising:
- a carrier;
- an interposer, having a bond pad and a contact pad, in an offset location over the carrier with an exposed side of the interposer coplanar with an edge of the carrier;
- an electrical interconnect between bond pad and the carrier;
- and
- a package encapsulation over the carrier and the electrical interconnect with both the contact pad and the exposed side of the interposer not covered.
Dependencies are inferred from the claim text.