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US 2009/0152630 A1Published application
Semiconductor device using soi-substrate
AssigneeOki Semiconductor Co., Ltd.
InventorHirokazu HAYASHI
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Abstract
According to a feature of the present invention, a semiconductor device includes a SOI substrate, including a semiconductor substrate; an insulating layer formed on the semiconductor substrate and a silicon layer formed on the insulating layer. A drain region and a source region are formed in the silicon layer so that the source region is in contact with the insulating layer but the drain region is not in contact with the insulating layer.
Claims2
A semiconductor device, comprising:
- a SOI substrate, including a semiconductor substrate;
- an insulating layer formed on the semiconductor substrate and a silicon layer formed on the insulating layer, wherein
- a drain region and a source region are formed in the silicon layer so that the source region is in contact with the insulating layer but the drain region is not in contact with the insulating layer.
Dependencies are inferred from the claim text.