Back to results
US 2009/0152577 A1Published application
Light emitting diode and manufacturing method thereof
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsShih-Hsiung Chan, Chih-Chiang Huang
Life of this patent
Estimating the term…
Abstract
A light emitting diode comprises a substrate having a first surface and a second surface, a light emitting epitaxy structure placed on the first surface of the substrate, and a compound reflection layer placed on the second surface of the substrate. The second surface of the substrate further has a protection structure.
Claims17
A light emitting diode, comprising:
- a substrate having a first surface and a second surface, wherein the second surface has a protection structure;
- a light emitting epitaxy structure placed on the first surface of the substrate;
- and
- a compound reflection layer placed on the second surface of the substrate.
1 more element
A fabrication method of a light emitting diode, comprising the steps of:
- providing a substrate, wherein the substrate has a first surface and a second surface;
- forming a light emitting epitaxy structure on the first surface of the substrate;
- forming a protection structure on the second surface of the substrate;
- and
- forming a compound reflection layer on the second surface of the substrate.
2 more elements
A fabrication method of a light emitting diode, comprising the steps of:
- providing a temporary substrate;
- forming a light emitting epitaxy structure on the temporary substrate;
- forming a substrate on the light emitting epitaxy structure;
- removing the temporary substrate;
- forming a protection structure on the substrate;
- and
- forming a compound reflection layer on the substrate.
4 more elements
A light emitting diode, comprising:
- an epitaxial substrate having a first surface and a second surface, wherein the second surface has a plurality of trenches;
- a light emitting epitaxy structure placed on the epitaxial substrate;
- and
- a compound metal reflection layer placed on the second surface of the epitaxial substrate, wherein the compound metal reflection layer supports the light emitting diode to mount on a package substrate by a eutectic joint method.
1 more element
Dependencies are inferred from the claim text.