Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts

Wafer, comprising at least one die, comprising first and second complementary signal processing parts, said first part having an input to receive first input signals and an output to deliver first output signals and said second part having an input to receive second input signals and an output to deliver second output signals, and scribe lanes defined between and around said die, characterized in that it comprises at least coupling means defined in at least a part of said scribe lanes and connecting i) the first part output of one of said dies to a second part input of at least one of said dies so that said first part output feeds said second part input with first output signals when it is fed with first input signals and configured to work and so that the output of the fed second part delivers second output signals when it is configured to work, and/or ii) the second part output of one of said dies to a first part input of at least one of said dies so that said second part output feeds said first part input with second output signals when it is fed with second input signals and configured to work and so that the output of the fed first part delivers first output signals when it is configured to work.