Chemical-mechanical polishing composition and method for using the same

A method of polishing a noble metal-containing substrate comprising the steps of:

• (a) providing a substrate, wherein the substrate comprises a noble metal selected from the group consisting of platinum, iridium, ruthenium, rhodium, palladium, silver, osmium, gold, and combinations thereof,
• (b) providing a chemical-mechanical polishing composition comprising:
• (i) an abrasive selected from the group consisting of α-alumina, γ-alumina, δ-alumina, θ-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof,
• (ii) about 0.05 to about 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and
• (iii) a liquid carrier comprising water,
• (c) applying the chemical-mechanical polishing composition to at least a portion of the substrate, and
• (d) abrading at least a portion of the noble metal of the substrate with the polishing composition to polish the substrate.