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US 2009/0151988 A1Published application
Flexible printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKyung Ho Lee, Se Min Oh, Chang Hwan Choi, Choon Keun Lee, Jeong Yeol Moon, Jong Rip Kim
Life of this patent
Estimating the term…
Abstract
An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.
Claims22
A flexible printed circuit board comprising:
- a first dielectric portion forming a dielectric layer;
- a second dielectric portion forming a dielectric layer opposite the first dielectric portion;
- and
- a conductive portion conducting electrical signals and having a neutral plane, wherein the neutral plane is located within a predetermined range of the thickness of the conductive portion, and has substantially zero strain due to bending between the first and second dielectric portions.
1 more element
A flexible printed circuit board comprising:
- a first dielectric portion subjected to tension in response to bending;
- a second dielectric portion subjected to compression in response to bending;
- and
- a conductive portion conducting electrical signals, and having a neutral plane, the neutral plane is within a predetermined range of the thickness of the conductive portion, and forms a substantial interface of tension and compression between the first and second dielectric portions.
1 more element
A flexible printed circuit board comprising:
- a conductive member including a conductive portion, which conducts electrical signals, and at least one dielectric layer;
- and
- a cover including a adhesive layer adhered to the conductive portion and at least one dielectric layer,
- wherein the thickness and the elastic modulus of the conductive member and the cover are determined so that a neutral plane is placed within a predetermined range of the thickness of conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the conductive member and the cover.
1 more element
A method of manufacturing a flexible printed circuit board, comprising:
- determining the elastic modulus of a conductive portion and the elastic modulus of first and second dielectric portions, which insulate the conductive portion;
- determining the thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the conductive member and the cover;
- and
- insulating the conductive portion according to the determined thickness and the determined elastic modulus.
1 more element
A method of manufacturing a flexible printed circuit board, comprising:
- adhering a cover, which includes a adhesive layer and at least one dielectric layer, to a conductive member, which includes a conductive portion and at least one dielectric layer;
- determining the elastic modulus and the thickness of a shield to be layered on at least one of the conductive member and the cover, so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane forming a substantial interface of tension and compression in response to bending;
- and
- layering the shield on at least one of the conductive member and the cover, with the elastic modulus and the thickness of the shield determined so that the neutral plane is located in the conductive portion.
1 more element
Dependencies are inferred from the claim text.