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US 2009/0151909 A1Published application
Heat-Dissipating Unit
AssigneeAsia Vital Components Co., Ltd.
InventorHsiuwei Yang
Life of this patent
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Abstract
A heat-dissipating unit is provided. The heat-dissipating unit includes a board. The board is thermally conductive and includes a contact portion planar in shape. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch portion extends outward from at least one end of the contact portion. With the contact portion being in immediate contact with the heat-generating source, heat is transferred from the heat-generating source to a remote end via the branch portion, thereby enhancing heat dissipation.
Claims3
A heat-dissipating unit, comprising:
- a board being thermally conductive and defined with a plane;
- a contact portion formed on said plane of said board, said contact portion being in immediate contact with a heat-generating source;
- and
- at least one branch portion extending outward from at least one end of said contact portion;
- wherein heat is transferred to a remote end via said branch portion, thereby enabling heat dissipation.
2 more elements
Dependencies are inferred from the claim text.