Compliant thermal interface design and assembly method
AssigneeInternational Business Machines Corporation
InventorsJohn P. Karidis, Mark D. Schultz
Life of this patent
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Abstract
A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.
Claims20
A method for producing a compliant thermal interface device for cooling an integrated circuit;
- the method comprising steps of:
- cutting a plurality of high thermal conductivity sheets according to at least one selected pattern;
- the high thermal conductivity sheets comprising a first material;
- forming spring elements in at least one of the plurality of high thermal conductivity sheets, such that the sheets comprise flat areas and spring elements;
- coating the high thermal conductivity sheets with a second material, wherein the second material is different from the first material;
- stacking the high thermal conductivity sheets;
- and
- bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.
A compliant thermal interface device comprising:
- a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheets is cut according to at least one pattern;
- a plurality of spring elements formed on at least one sheet;
- a coating applied over at least two of the sheets;
- and
- bonding of at least a portion of the coatings of the at least two sheets.
A compliant thermal interface device comprising:
- a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheets is cut according to at least one pattern;
- a plurality of spring elements formed on at least one sheet;
- and
- a plurality of cooling fin elements separate from the spring elements formed on the at least one sheet
Dependencies are inferred from the claim text.