Back to results
US 2009/0151900 A1Published application
Heat sink
OwnerTsung-Hsien Huanginventor
Life of this patent
Estimating the term…
Abstract
A heat sink includes a thermal conductive base panel that has a plurality of heat dissipation columns of any of a variety of configurations perpendicularly upwardly extending from the top wall, and radiation fins mounted on the heat dissipation columns at different elevations, each radiation fin having a plurality of mounting through holes respectively press-fitted onto the heat dissipation columns. The base panel may be provided with a fan and/or heat pipes to enhance heat dissipation efficiency.
Claims22
A heat sink comprising:
- a thermal conductive base panel, said base panel having a plurality of heat dissipation columns perpendicularly upwardly extending from a top wall thereof and respectively spaced from one another at a distance;
- and
- a plurality of radiation fins mounted on said heat dissipation columns at different elevations, said radiation fins each having a plurality of mounting through holes respectively press-fitted onto said heat dissipation columns.
Dependencies are inferred from the claim text.