Heat dissipation device

A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

• a heat sink has a base plate and a plurality of parallel fins extending upwardly from a top surface of the base plate, the heat sink defining a plurality lengthways channels between every two neighboring fins and a plurality of transverse channels unparallel to the lengthways channels;
• and
• a clip comprising a main body disposed on the base plate and two latching legs extending oppositely from two free ends of the main body, one part of the main body being received in the lengthways channels and other part of the main body being received in the transverse channels, the two latching legs located at two opposite sides of the heat sink.

A heat dissipation device comprising:

• a heat sink having a base plate, a plurality of fins extending upwardly from the base plate, a plurality of first and second channels extending through the fins, the second channels interlaced with the first channels;
• and
• a clip having a pressing section fitted in one of the first channels and two pivoting sections extend obliquely and upwardly from two opposite ends of the pressing section, the two pivoting sections received in two of spaced second channels, a pair of latching legs extending from opposite ends of the pivoting sections, each leg having a hook formed at a free end thereof, the hook being adapted for engaging with a printed circuit board thereby securing the heat sink to the printed circuit board.