High performance compliant thermal interface cooling structures
AssigneeInternational Business Machines Corporation
InventorsJohn P. Karidis, Mark D. Schultz
Life of this patent
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Abstract
A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding areas of the stacked sheets using thermo-compression bonding.
Claims20
A semiconductor cooling device comprising:
- a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheet is cut according to at least one pattern;
- cooling structures cut into the at least one sheet, wherein the at least one sheet includes apertures for carrying coolant into and out of said cooling structure;
- and
- at least one thermal isolation element positioned between at least one of the apertures for channeling coolant into the cooling structure and at least one of the apertures for channeling coolant out of the cooling structure.
A compliant thermal interface device comprising:
- a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheet is cut according to at least one pattern;
- a plurality of spring elements formed on at least one sheet;
- and
- at least one flow restricting strip positioned between at least two spring elements.
A compliant thermal interface device comprising:
- a plurality of stacked sheets of a high thermally conductive material, wherein at least one stacked sheet is cut according to at least one pattern;
- a plurality of spring elements formed on at least one sheet;
- a plurality of cooling structures cut into at least one sheet, wherein the at least one sheet comprises a plurality of apertures for carrying coolant into and out of said cooling structures;
- and
- at least one cross-tie element in at least one sheet positioned between at least one of said apertures and at least one cooling structure.
Dependencies are inferred from the claim text.