Method and Composition for Cleaning Wafers
AssigneeFontana Technology
InventorMark Jonathan Beck
Life of this patent
Estimating the term…
Abstract
A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.
Claims20
A solution for removing submicron particles from the surface of a semiconductor wafer having at least one electronic feature formed on the surface, the solution comprising a cleaning agent selected from the group consisting of a polycarboxylate polymer, an ethoxylated polyamine, and an ethoxylated quaternized diamine.
A method for removing submicron particles from the surface of a semiconductor wafer having at least one electronic feature formed on the surface, comprising contacting the surface with a cleaning solution comprised of a cleaning agent selected from the group consisting of a polycarboxylate polymer, an ethoxylated polyamine, and an ethoxylated quaternized diamine.
Dependencies are inferred from the claim text.