Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device having a reduced cost, manufacturing time, weight, and thickness

An apparatus comprising:

• a first support layer;
• at least one electronic component positioned on one side of the first support layer, the at least one electronic component including at least one conductive portion, the at least one conductive portion being adapted to communicate with an electronic device;
• an adhesive layer disposed on the side of the first support layer carrying the at least one electronic component;
• and
• a second support layer disposed on the adhesive layer so that the at least one electronic component is laminated between the first and second support layers to form a composite layer, the composite layer being adapted to operably engage the electronic device such that the at least one electronic component is capable of communicating with the electronic device via the at least one conductive portion
• wherein the first support layer defines at least one aperture, the at least one aperture configured to receive the at least one conductive portion of the at least one electronic component such that the at least one electronic component is recessed within the first support layer.