US 2009/0023855 A1 · NOVEL CURABLE RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE

Abstract

A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent. [Formula 1] R1nSiR2(4-n) (I-1) (Wherein, n denotes a number of 0 to 2; R1 represent a hydrogen atom, or substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms; R2 represent a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups, amino groups, and carbonyloxy groups having 1 to 18 carbon atoms; and two or more of R1 and R2 may bind to each other to form a cyclic structure).

Claims35

Dependent claims

A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with phenol compounds (b), comprising

a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin:
[Formula 1]
R1nSiR2(4-n) (I-1)
(Wherein,
n denotes a number of 0 to 2;
R1 each independently represent a group selected from the group consisting of a hydrogen atom and substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms, and may be identical or different from each other;
R2 each independently represent a group selected from the group consisting of a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups having 1 to 18 carbon atoms, substituted or unsubstituted amino groups having 1 to 18 carbon atoms, and carbonyloxy groups having 2 to 18 carbon atom, and may be identical or different from each other;
and
two or more of R1 and R2 may bind to each other to form a cyclic structure).

6 more elements

A curable resin having an aryloxysilyl (ArO—Si) bond, comprising at least one structural unit selected from the group consisting of the structural units represented by following Formula (I-2a), (I-3a), (I-2b), and (I-3b):

(Wherein, Ar represents a divalent organic group having 2 to 30 carbon atoms and having aromatic cyclic compound-derived groups at both sides);
(Wherein, Ar represents a divalent organic group having 2 to 30 carbon atoms and having aromatic cyclic compound-derived groups at both sides;
and n denotes a number of 0 or more);
(Wherein, Ar2 represents a (m+2)-valent organic group having 2 to 30 carbon atoms and having at least two aromatic cyclic compound-derived binding sites;
and m denotes an integer of one or more);
and
(Wherein, Ar2 represents a (m+2)-valent organic group having 2 to 30 carbon atoms and having at least two aromatic cyclic compound-derived binding sites;
n denotes a number of 0 or more;
and m denotes an integer of one or more).

6 more elements

A curable resin, comprising at least one of a compound having the structural unit represented by the following Formula (I-4a) and a compound having the structural unit represented by the following Formula (I-4b):

(Wherein, Ar represents a divalent organic group having 2 to 30 carbon atoms and having aromatic cyclic compound-derived groups at both sides);
and
(Wherein, Ar2 represents a (m+2)-valent organic group having 2 to 30 carbon atoms and having at least two aromatic cyclic compound-derived binding sites;
and each m independently denotes an integer of 1 or more).

1 more element

Dependencies are inferred from the claim text.

Novel curable resin, production method thereof, epoxy resin composition, and electronic device

Life of this patent

Novel curable resin, production method thereof, epoxy resin composition, and electronic device

Life of this patent

Abstract

Claims35