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AssigneeUnited Microelectronics Corp.
InventorsChang-Hsin Wu, Tzu-Hung Yang, Shao-Wei Chen, Yi-Chin Liu, Yu-Siang Yang, Pei-Lin Kuo, Hui-Shen Shih
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A polishing head used for CMP is described, including a retaining ring that is for engaging with a wafer, a membrane and an edge control ring. The membrane includes a bottom part for engaging with the wafer, and a lip part contiguous with the bottom part. The edge control ring is disposed between the retaining ring and the membrane, including a bottom part that has an abutting surface. The abutting surface of the edge control ring contacts with the external surface of the lip part of the membrane when the membrane is not inflated.
A polishing head used for chemical mechanical polishing (CMP), comprising:
An edge control ring that is to be mounted on a polishing head used for CMP, wherein the polishing head also comprises a membrane that has a lip part under the edge control ring and is inflated in a CMP process, the edge control ring comprising:
A method of increasing a polishing rate at a wafer edge in a CMP process that uses a polishing head, the polishing head comprising an edge control ring and a membrane that has a lip part under the edge control ring and is inflated in the CMP process, the method comprising:
Dependencies are inferred from the claim text.