Method of manufacturing a semiconductor integrated circuit device
AssigneeRenesas Electronics Corporation
InventorYoshiaki Kobayashi
Life of this patent
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Abstract
A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-charge-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.
Claims16
A method of manufacturing a semiconductor integrated circuit device, comprising:
- (a) connecting an internal space of a sealed type wafer container, which accommodates a plurality of wafers, to a local clean chamber of a wafer treatment apparatus;
- (b) transporting said wafer accommodated in said wafer container under the connecting state to a load lock and/or unload lock mechanism disposed between a wafer treatment chamber of said wafer treatment apparatus and said local clean chamber, through said local clean chamber, by a transport mechanism disposed in said local clean chamber;
- (c) performing a treatment to said wafer in said wafer treatment chamber;
- (d) after step (c), transporting treated wafer in said load lock and/or unload lock mechanism to said wafer container through said local clean chamber by said transport mechanism;
- (e) eliminating static charge of said treated wafer in step (d);
- and
- (f) releasing the connected state between said wafer container and said local clean chamber after said step (d).
Dependencies are inferred from the claim text.