Conductive ball mounting method and apparatus
AssigneeShinko Electric Industries Co., Ltd.
InventorsHideaki Sakaguchi, Kiyoaki Iida, Kazuo Tanaka
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Abstract
There is provided a method of mounting conductive balls on pads on a substrate. The method includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.
Claims9
A method of mounting conductive balls on pads on a substrate, the method comprising:
- (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container;
- and
- (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads,
- wherein step (b) is repeatedly performed.
A conductive ball mounting apparatus for mounting conductive balls on pads on a substrate, the conductive ball mounting apparatus comprising:
- a container for containing the conductive balls therein and whose top surface is open;
- a substrate holder for holding the substrate having the pads coated with an adhesive over the container such that the pads faces the top surface of the container;
- and
- a conductive ball throwing up apparatus for throwing up the conductive balls in the container by moving the container up and down at a given stroke so as to allow the conductive balls to adhere to the adhesive coated on the pads.
Dependencies are inferred from the claim text.