Semiconductor Device and Method of Making Same
AssigneeKabushiki Kaisha Tokai Rika Denki Seisakusho
InventorsMasaya Tajima, Katsuya Kogiso, Mitsuo Watanabe, Toshiki Matsubara, Kenji Sato
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Abstract
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a thermosetting epoxy resin. The surface of the package is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals extend from the package and housing in parallel. A portion of the terminals is also sealed in the housing together with the package. Thus, the device is easily produced by insert molding and has excellent moisture resistance.
Claims3
A method of making a semiconductor device comprising:
- (a) UV-irradiating a semiconductor package formed of thermosetting epoxy resin to modify its surface to be adhesive to polyamide;
- (b) placing said semiconductor package in a die;
- and
- (c) filling a space in said die with melted polyamide or a melted thermoplastic resin including polyamide to seal said semiconductor package by insert molding, wherein said melted polyamide or thermoplastice resin including polyamide hardens to form a housing around said semiconductor package.
Dependencies are inferred from the claim text.