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US 2009/0023250 A1Published application
Apparatus and method for producing semiconductor modules
AssigneeInfineon Technologies AG
InventorsRoland Speckels, Karsten Guth, Hans Hartung
Life of this patent
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Abstract
An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.
Claims20
An apparatus comprising:
- a carrier;
- a support film having an adhesive layer on one of its surfaces, configured to attach a semiconductor die to the support film;
- and
- a pressure tool configured to press the semiconductor die attached to the support film onto the carrier, to fixedly mount the semiconductor die onto the carrier.
1 more element
A method comprising:
- providing a support film, the support film comprising an adhesive layer;
- arranging a semiconductor die onto the support film strip in a predetermined layout, the semiconductor die being attached to the support film by the adhesive layer;
- and
- pressing the support film onto a carrier to fixedly mount the semiconductor die onto the carrier.
1 more element
An apparatus comprising:
- a carrier;
- a support film having an adhesive layer on one of its surfaces, configured to attach a semiconductor die to the support film;
- and
- pressure tool means for pressing the semiconductor die attached to the support film onto the carrier, to fixedly mount the semiconductor die onto the carrier.
1 more element
Dependencies are inferred from the claim text.