US 2009/0023234 A1 · METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE

Abstract

A method for manufacturing light emitting diode (LED) package first fabricates a silicon submount with at least one groove by wet etching, wherein a reflective layer, a transparent insulation layer and a metal bump are successively formed in the silicon submount. An LED die is mounted in the groove of the silicon submount. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.

Claims24

Dependent claims

A method for manufacturing light emitting diode package, comprising:

providing a silicon groove array with a plurality of grooves;
forming a light reflection layer and a transparent insulating layer on an inner surface of each groove, respectively;
forming a metal block on the transparent insulating layer in each of the grooves;
mounting a light emitting diode chip on the metal block, wherein electrodes of the metal block are arranged on a face opposite to the metal block;
singularizing the silicon groove array into a plurality of silicon submounts, wherein each of the silicon submounts comprises at least one groove;
filling the groove with a protective glue such that the silicon submount has an even top surface;
and
printing a phosphor layer on the protective glue.

5 more elements

Dependencies are inferred from the claim text.

Method for manufacturing light emitting diode package

Life of this patent

Method for manufacturing light emitting diode package

Life of this patent

Abstract

Claims24