Semiconductor Device Manufacturing Method and Method for Reducing Microroughness of Semiconductor Surface
AssigneesTohoku University, Foundation for Advancement of International Science
InventorsTadahiro Ohmi, Hitoshi Morinaga
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Abstract
Surface treatment is performed with a liquid, while shielding a semiconductor surface from light. When the method is employed for surface treatment in wet processes such as cleaning, etching and development of the semiconductor surface, increase of surface microroughness can be reduced. Thus, electrical characteristics and yield of the semiconductor device are improved.
Claims20
A semiconductor device manufacturing method, comprising a surface treatment process in which a surface of a semiconductor material is exposed to a liquid, the surface treatment process being performed in a light shielding state so that the surface of the semiconductor material is not exposed to light.
A method for reducing surface microroughness of a semiconductor surface, comprising a surface treatment process in which a surface of a semiconductor material is exposed to a liquid, the surface treatment process being performed in a treatment chamber shielded from light so that the surface of the semiconductor material is not exposed to light.
A semiconductor device manufacturing apparatus, comprising a treatment chamber in which a surface treatment process is performed, the treatment chamber having a light shielding member and being shielded from light so that a surface of a semiconductor is not exposed to light.
A semiconductor device manufacturing method, comprising a process for treating a semiconductor material in a state in which adsorbed moisture is present on a surface of the semiconductor material, the process being performed in a light-shielding state so that the surface of the semiconductor material is not exposed to light.
Dependencies are inferred from the claim text.