Methods of Processing Substrates, Electrostatic Carriers for Retaining Substrates for Processing, and Assemblies Comprising Electrostatic Carriers Having Substrates Electrostatically Bonded Thereto

An electrostatic carrier for retaining a substrate for processing, comprising:

• a carrier substrate;
• a conductive electrode on the carrier substrate adapted for physical contact with a conductor that applies a voltage effective to generate an electrostatic charge for retaining a substrate to the carrier substrate for processing;
• and a self-healing dielectric material received over the conductive electrode and through which the conductor is adapted to penetrate.

An assembly comprising:

• an electrostatic carrier comprising a conductive electrode adapted for physical contact with a conductor that applies a voltage to the electrostatic carrier, a self-healing dielectric material received over the conductive electrode and through which the conductor is adapted to penetrate;
• and
• a substrate electrostatically bonded to the electrostatic carrier.

An electrostatic carrier for retaining a substrate for processing, comprising:

• a carrier substrate;
• a conductive electrode on the carrier substrate adapted for physical contact with a conductor that applies a voltage effective to generate an electrostatic charge for retaining a substrate to the carrier substrate for processing;
• and dielectric adhesive tape adhered to the conductive electrode.

An assembly comprising:

• an electrostatic carrier comprising a conductive electrode adapted for physical contact with a conductor that applies a voltage to the electrostatic carrier, dielectric adhesive tape adhered to the conductive electrode;
• and
• a substrate electrostatically bonded to the electrostatic carrier.

An electrostatic carrier for retaining a substrate for processing, comprising:

• a carrier substrate;
• a conductive electrode on the carrier substrate adapted for physical contact with a conductor that applies a voltage effective to generate an electrostatic charge for retaining a substrate to the carrier substrate for processing;
• and at least one of photoresist and polyimide received over the conductive electrode.

An assembly comprising:

• an electrostatic carrier comprising a conductive electrode adapted for physical contact with a conductor that applies a voltage to the electrostatic carrier, at least one of photoresist and polyimide received over the conductive electrode;
• and
• a substrate electrostatically bonded to the electrostatic carrier.