US 2009/0021974 A1 · SEMICONDUCTOR DEVICE

Abstract

A semiconductor device where multiple chips of identical design can be stacked, and the spacer and interposer eliminated, to improve three-dimensional coupling information transmission capability. A first semiconductor circuit including a three-dimensional coupling circuit (three-dimensional coupling transmission terminal group and three-dimensional coupling receiver terminal group); and a second semiconductor integrated circuit including a three-dimensional coupling circuit and feed-through electrode (power supply via hole and ground via hole); and a third semiconductor integrated circuit including a three-dimensional coupling circuit and feed-through electrode are stacked on the package substrate.

Claims12

Dependent claims

A semiconductor device comprising:

a first semiconductor integrated circuit including a first three-dimensional coupling circuit;
a second semiconductor integrated circuit including a first feed-through electrode and a second three-dimensional coupling circuit for inductively coupling to the first three-dimensional coupling circuit;
and
a third semiconductor integrated circuit including a second feed-through electrode connected to the first feed-through electrode, and a third three-dimensional coupling circuit inductively coupling to the first three-dimensional coupling circuit,
wherein the first, second, and third semiconductor integrated circuits are stacked.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims12