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US 2009/0021915 A1Published application
Multi-layer heat-dissipating device
AssigneeInventec Multimedia & Telecom (Tianjin) Co., Ltd.
InventorTing-Chang Kuo
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Abstract
A multi-layer heat-dissipating device is provided. The multi-layer heat-dissipating device does not use fans, absorbs heat energy sequentially with heat-conducting elements and a heat-dissipating metal sheet, and effectively blocks heat radiation of a heat-generating element, so as to achieve the effects of power saving, no noise, and less occupied space.
Claims7
A multi-layer heat-dissipating device, disposed in an electronic product having a plastic case, for effectively dissipating heat generated by a heat-generating element on a printed circuit board of the electronic product, comprising:
- a heat-dissipating fin set, having a bottom end contacting the heat-generating element for dissipating heat;
- a first heat-conducting element, attached on a top end of the heat-dissipating fin set, for conducting heat of the heat-dissipating fin set;
- and
- a heat-dissipating metal sheet, attached on the first heat-conducting element, for absorbing heat conducted by the first heat-conducting element.
1 more element
Dependencies are inferred from the claim text.