Heat dissipation device
AssigneeFoxconn Technology Co., Ltd.
InventorZHI-BIN KUAN
Life of this patent
Estimating the term…
Abstract
A heat dissipation device includes a heat spreader (20), a heat pipe (30), a heat sink (40) and a cooling fan (50) for generating forced airflow to the heat sink. The heat pipe has an evaporating section (301) being thermally attached to the heat spreader and a condensing section (302). The heat sink has a fin assembly defining a plurality of channels (405) for the airflow flowing therethrough. Each of the channels has at least one portion with a width being gradually decreased along the flowing direction of the airflow. The channels (405) each are defined between two adjacent fins (401, 402), wherein at least one of the two adjacent fins is arc-shaped.
Claims22
A heat dissipation device comprising:
- a heat spreader for thermally attaching to a heat-generating electronic component to absorb heat therefrom;
- a heat pipe having an evaporating section being thermally attached to the heat spreader and a condensing section extending from the evaporating section to a position beyond the heat spreader;
- a cooling fan for generating forced airflow;
- and
- a heat sink having a fin assembly defining a plurality of channels for the airflow flowing therethrough, each of the channels having an air inlet from which the forced airflow enters the heat sink and an air outlet for the forced airflow flowing out the heat sink, along a flowing direction of the airflow a width of the each of the channels between two adjacent fins gradually decreased along an entire length of the each of the channels, the each of the channels having a maximum width at the air inlet and a minimum width at the air outlet.
2-4. (canceled)
A heat dissipation device comprising:
- a heat-generating electronic component;
- a heat spreader thermally connecting with the heat-generating electronic component to absorb heat therefrom;
- a heat pipe having an evaporating section thermally connecting with the heat spreader and a condensing section;
- a heat sink thermally connecting with the condensing section of the heat pipe and having a plurality of fins defining a plurality of channels therebetween, wherein a width of each of the channels is varied along a length thereof;
- wherein the channels each have a maximum width at a first opened end thereof and a minimum width at a second opened end thereof, the second opened end being opposite to the first opened end, a fan being located between the first opened end of the each channel of the heat sink and the heat spreader.
12-17. (canceled)
(canceled)
A heat dissipation device comprising:
- a heat-generating electronic component;
- an elongated flat substrate defining an elongated groove therein;
- a straight heat pipe being received in the groove of the substrate entirely, the heat pipe having an evaporating section and a condensing section formed at two opposite ends, and an adiabatic section between the evaporating section and the condensing section;
- a heat spreader thermally connecting with the heat-generating electronic component to absorb heat therefrom, the heat spreader being arranged on the substrate and thermally attaching to the evaporating section of the heat pipe;
- a cooling fan for generating a forced airflow;
- and
- a heat sink arranged on the substrate and thermally attaching to the condensing section of the heat pipe, the heat sink comprising a plurality of fins defining a plurality of channels therebetween, each of the channels having an air inlet from which the forced airflow enters the heat sink and an air outlet for the forced airflow flowing out the heat sink, each channel having a width between two adjacent fins gradually decreasing from the air inlet to a middle of the each channel.
Dependencies are inferred from the claim text.