Modular high-density computer system
AssigneeHewlett-Packard Development Company, L.P.
InventorsRonald M. Mann, Gary S. Landrum, Robert M. Hintz
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Abstract
A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.
Claims15
A modular high-density computer system comprising:
- an infrastructure comprising:
- a framework component forming a plurality of bays;
- one or more cooling components;
- one or more computational components comprising:
- a rack assembly;
- and
- a plurality of servers installed in the rack assembly;
- and
- wherein each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the installation site.
A modular high-density computer system comprising:
- an infrastructure comprising:
- a framework component forming a plurality of bays;
- a power distribution component and a connector coupled thereto;
- a data I/O distribution component and a connector coupled thereto;
- and
- one or more cooling components;
- and
- one or more rack assemblies comprising:
- a power distribution strip for providing power to a plurality of servers when installed therein;
- and a connector coupled to the power distribution strip for coupling with the connector of the power distribution component when installed in one of the plurality of bays;
- and
- a data I/O distribution strip for coupling data I/O to a plurality of servers when stored therein;
- and a connector coupled to the data I/O distribution strip for coupling with the connector of the data I/O distribution component when installed in one of the plurality of bays;
- and
- wherein each of the one or more rack assemblies is shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the installation site.
A method of manufacturing a high-density computer system comprising:
- assembling an infrastructure comprising:
- a framework component forming a plurality of bays;
- one or more cooling components;
- assembling one or more computational components, said assembling further comprising installing a plurality of servers in a rack assembly;
- shipping the infrastructure to an installation site separately from and ahead of the one or more computational components;
- installing the infrastructure at the installation site;
- shipping the one or more computational components to the installation site;
- and
- installing each of the one or more computational components in one of the plurality of bays after the infrastructure is installed at the installation site.
Dependencies are inferred from the claim text.