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US 2009/0020892 A1Published application
Selectively altering a predetermined portion or an external member in contact with the predetermined portion
AssigneeHewlett-Packard Development Company, L.P.
InventorZhiyong Li
Life of this patent
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Abstract
A method for selectively altering a predetermined portion of an object or an external member in contact with the predetermined portion of the object is disclosed. The method includes selectively electrically addressing the predetermined portion, thereby locally resistive heating the predetermined portion, and exposing the object, including the predetermined portion, to the external member.
Claims20
A method for selectively altering a predetermined portion of an object or an external member in contact with the predetermined portion of the object, the method comprising:
- selectively electrically addressing the predetermined portion, thereby locally resistive heating the predetermined portion;
- and
- exposing the object, including the predetermined portion, to the external member.
A nanowire array, comprising:
- a first nanowire having a predetermined functionalized surface;
- and
- a second nanowire having a predetermined functionalized surface that is different from the predetermined functionalized surface of the first nanowire.
Dependencies are inferred from the claim text.