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US 2009/0020885 A1Published application
Semiconductor device and method of manufacturing the same
OwnerMasanori Onoderainventor
Life of this patent
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Abstract
One embodiment in accordance with the invention can include a semiconductor device that includes a first substrate, a projection portion that has a first semiconductor chip mounted on the first substrate, a second substrate that is provided on the first substrate and is electrically coupled to the first substrate, and a second semiconductor chip that is mounted on the second substrate. An opening portion is formed by the second substrate. The projection portion is arranged in the opening portion.
Claims20
A semiconductor device comprising:
- a first substrate;
- a projection portion that has a first semiconductor chip mounted on the first substrate;
- a second substrate that is provided on the first substrate and is electrically coupled to the first substrate;
- and
- a second semiconductor chip that is mounted on the second substrate,
- wherein the second substrate forms an opening portion;
- and
- the projection portion is arranged in the opening portion.
5 more elements
A wireless communications device, comprising:
- a processor;
- a communications component coupled to the processor;
- a transmitter coupled to the processor;
- a receiver;
- an antenna coupled to the transmitter circuit and the receiver circuit;
- and
- a memory coupled to the processor, the memory comprising:
- a first substrate;
- a projection portion that has a first semiconductor chip mounted on the first substrate;
- a second substrate that is provided on the first substrate and is electrically coupled to the first substrate;
- and
- a second semiconductor chip that is mounted on the second substrate,
- wherein the second substrate forms an opening portion;
- and
- the projection portion is arranged in the opening portion.
12 more elements
A computing device comprising:
- a processor;
- an input component coupled to the processor;
- an output component coupled to the processor;
- and
- a memory coupled to the processor, the memory comprising:
- a first substrate;
- a projection portion that has a first semiconductor chip mounted on the first substrate;
- a second substrate that is provided on the first substrate and is electrically coupled to the first substrate;
- and
- a second semiconductor chip that is mounted on the second substrate,
- wherein the second substrate forms an opening portion;
- and
- the projection portion is arranged in the opening portion.
10 more elements
Dependencies are inferred from the claim text.