Semiconductor devices and manufacturing methods therefor
AssigneeMitsubishi Electric Corporation
InventorsJunji Fujino, Shinichi Takagi
Life of this patent
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Abstract
A semiconductor device includes: a package case in which a semiconductor element is mounted, the package case having a bonding portion; a cap having a bonding portion bonded to the bonding portion of the package case so as to hermetically seal the semiconductor element; and one or more bonding/sealing wires disposed between and in contact with the bonding portion of the package case and the bonding portion of the cap such that the one or more bonding/sealing wires form a closed loop and hermetically seal the semiconductor element.
Claims11
A semiconductor device comprising:
- a package case in which a semiconductor element is mounted and having a bonding portion;
- a cap having a bonding portion bonded to said bonding portion of said package case, hermetically sealing said semiconductor element;
- and
- at least one bonding/sealing wire disposed between and in contact with said bonding portion of said package case and said bonding portion of said cap such that said at least one bonding/sealing wire forms a closed loop and thereby hermetically seals said semiconductor element.
A method for manufacturing a semiconductor device comprising:
- disposing a bonding/sealing wire in a closed loop on one of a bonding portion of a package case and a bonding portion of a cap, said package case having a semiconductor element mounted therein and
- bonding said bonding portion of said package case and said bonding portion of said cap together by said bonding/sealing wire to hermetically seal said semiconductor element, wherein disposing said bonding/sealing wire includes:
- disposing a first end of said bonding/sealing wire on one of said bonding portion of said package case and said bonding portion of said cap,
- forming a concave portion at a predetermined location on said first end of said bonding/sealing wire, and
- a second end of said bonding/sealing wire over said concave portion of said first end of said bonding/scaling wire.
Dependencies are inferred from the claim text.