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US 2009/0020861 A1Published application
Semiconductor device
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.
Claims29
A module, comprising:
- a carrier;
- a semiconductor chip applied to the carrier;
- and
- an external contact element having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.
1 more element
A module, comprising:
- a power semiconductor chip;
- a control semiconductor chip;
- a first external contact element electrically coupled to the power semiconductor chip;
- a second external contact element electrically coupled to the control semiconductor chip;
- and
- wherein the first and second external contact elements define an assembly plane and extend in a first direction perpendicular to the assembly plane, wherein the extension of the first external contact element in the first direction is larger than the extension of the second external contact element in the first direction.
3 more elements
A module, comprising:
- a ceramic carrier having a first main surface, an opposite second main surface and side surfaces;
- an external contact element applied to the first main surface and at least one of the side surfaces of the ceramic carrier;
- and
- a semiconductor chip arranged on the second main surface of the ceramic carrier.
1 more element
A method, comprising:
- providing a carrier and an external contact element having a first portion and a second portion extending perpendicular to the first portion;
- and
- placing a semiconductor chip on the carrier.
A method, comprising:
- providing a carrier and an external contact element;
- placing a semiconductor chip on the carrier;
- depositing a mold material on the semiconductor chip;
- and
- depositing an electrically conductive material on a side surface of the mold material, wherein the electrically conductive material is electrically coupled to the external contact element.
2 more elements
A module, comprising:
- a carrier;
- a semiconductor chip applied to the carrier;
- and
- an external contact element, wherein the external contact element has a first portion having a first height which is greater than a height of the carrier.
1 more element
Dependencies are inferred from the claim text.