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US 2009/0020854 A1Published application
Process of forming ultra thin wafers having an edge support ring
AssigneeAlpha and Omega Semiconductor Incorporated
InventorsTao Feng, Sung-Shan Tai
Life of this patent
Estimating the term…
Abstract
A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.
Claims19
An ultra thin wafer having an edge support ring comprising:
- an ultra thin central portion;
- and
- a peripheral edge support ring, the edge support ring having an angled inner wall.
A process of forming an ultra thin wafer having an edge support ring comprising the steps of:
- positioning a grinding wheel proximate a wafer backside edge;
- grinding the wafer backside while gradually reducing a distance between a grinding wheel axis of rotation and a wafer chuck axis of rotation;
- and
- ending the grinding of the wafer backside when an ultra thin central portion thickness is achieved.
1 more element
A process of forming an ultra thin wafer having an edge support ring having an angled inner wall comprising the steps of:
- positioning a grinding wheel having profiled teeth proximate a wafer backside edge;
- grinding the wafer backside;
- and
- ending the grinding of the wafer backside when an ultra thin central portion thickness is achieved.
1 more element
A process of forming an ultra thin wafer having an edge support ring comprising the steps of:
- positioning a first grinding wheel a distance from a wafer backside edge;
- grinding a wafer backside to form an ultra thin central portion and an edge support ring until an ultra thin central portion thickness is achieved;
- positioning a second grinding wheel to grind an angled inner wall of the edge support ring;
- and
- grinding the edge support ring to form the angled inner wall.
2 more elements
Dependencies are inferred from the claim text.