Light emitting device and method of manufacturing the same

A method of manufacturing a light emitting device having a light emitting element, a package for arranging the light emitting element, and an electrically conductive wire for connecting an electrode disposed on the package and an electrode of the light emitting element, the package including a support member having a mounting portion to arrange the light emitting element and defining a recess to house a semiconductor element which is different than the light emitting element, and a light transmissive member disposed on the support member, the light transmissive member at least covering the light emitting element and the opening of the recess, and a hollow portion being retained in the recess formed in the package, the method comprising:

• a first step of forming a support member defining a recess which opens to an upper surface of the support member where the light emitting element to be mounted,
• a second step of housing the semiconductor element such that the upper surface of the semiconductor element is lower than the mounting portion of the light emitting element,
• a third step of arranging the light emitting element and the electrically conductive wire, and
• a fourth step of disposing a light transmissive member on the support member so as to cover at least the light emitting element and the opening of the recess while defining a hollow portion in the recess.