Back to results
US 2009/0020503 A1Published application
Substrate etching apparatus and substrate etching method
AssigneeSamsung Electronics Co., Ltd.
InventorsJung-Sub Kim, Seung-Lyong Bok
Life of this patent
Estimating the term…
Abstract
A substrate etching apparatus includes a chamber in which first and second insulating substrates are received, a blocking shutter, and a first spray head. The first spray head is arranged in the chamber and sprays an etchant toward the first insulating substrate. The blocking shutter surrounds end portions of the first and second substrates and isolates a first area in which the first insulating substrate is positioned from a second area in which the second insulating substrate is positioned.
Claims27
A substrate etching apparatus comprising:
- a chamber comprising a first area and a second area adjacent to the first area, the chamber receiving a first substrate and a second substrate at a boundary between the first and second areas, the first and second substrates facing each other;
- a blocking shutter positioned at the boundary between the first and second areas and surrounding end portions of the first and second substrates to isolate the first area in which the first substrate is positioned from the second area in which the second substrate is positioned;
- a first spray head comprising at least one nozzle that is positioned in the first area to spray a first etchant into the first area;
- and
- a first etchant supplier containing the first etchant and supplying the first etchant to the first spray head.
2 more elements
A method of etching a substrate, comprising:
- loading a first substrate and a second substrate facing the first substrate into a chamber;
- coupling a blocking shutter positioned inside the chamber with end portions of the first and second substrates to isolate a space inside the chamber into a first area in which the first substrate is positioned and a second area in which the second substrate is positioned;
- and
- spraying a first etchant to the first substrate to be differently etched from the second substrate.
1 more element
Dependencies are inferred from the claim text.