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AssigneeApplied Materials, Inc.
InventorsJames Scholhammer, Uwe Hoffmann, Jose Manuel Dieguez-Campo
Estimating the term…
A sputter coating device comprises a vacuum coating chamber, substrates arranged within the coating chamber, a cylindrical hollow cathode including a rotatable target rotating around a central axis A, and a magnet assembly which is arranged within the hollow cathode such that confining plasma zones are generated in an area above the surface of the target. At least one substrate is to be coated. The substrate has an OLED layer deposited on the substrate surface. An intermediate area is arranged between the surface of the target and a shield that shields particles sputtered from the surface of the target that move in a direction toward the shield. On each side of the shield, passages are provided between the intermediate area and coating area. Through the passage, only sputtered particles that have been scattered in the intermediate area may enter the coating area via the passage, and impinge the OLED layer.
A sputter coating device for depositing a layer on a substrate having an organic material layer deposited thereon, the sputter coating device comprising:
A method of depositing a layer on a substrate having an organic material layer deposited thereon, the method comprising the steps of:
The method according to 10, wherein the step c) comprises providing a second rotatable cathode unit arranged in the first coating chamber, the second cathode unit comprising a second rotatable target and a second magnet assembly for generating a second plasma confinement zone arranged above a surface section of the second target.
Dependencies are inferred from the claim text.