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US 2009/0020324 A1Published application
Wired circuit board
AssigneeNitto Denko Corporation
InventorsKatsutoshi Kamei, Visit Thaveeprungsriporn, Kazuya Nakamura
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Abstract
A wired circuit board comprises a metal supporting board, a metal foil formed on the metal supporting board, a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy, a first insulating layer formed on the metal supporting board to cover the first protecting layer, a conductive pattern formed on the insulating layer, and a second protecting layer formed on the surface of the conductive pattern, the second protecting layer is made of tin or a tin alloy.
Claims5
A wired circuit board comprising:
- a metal supporting board;
- a metal foil formed on the metal supporting board;
- a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy;
- a first insulating layer formed on the metal supporting board to cover the first protecting layer;
- a conductive pattern formed on the insulating layer;
- and
- a second protecting layer formed on the surface of the conductive pattern, the second protecting layer is made of tin or a tin alloy.
4 more elements
Dependencies are inferred from the claim text.