Probe assembly and method for producing it
AssigneeKabushiki Kaisha Nihon Micronics
InventorsMasatoshi YOKOUCHI, Katsushi MIKUNI, Masahisa TAZAWA, Norihiro IMAI
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Abstract
A method of producing a probe assembly which uses thermal energy of a laser light for bonding a plurality of connection pads provided on a probe board and a probe disposed on each connection pad. In the neighborhood of at least one of the connection pads on the probe board, a dummy connection pad with no probe adhered is formed in order to uniform the thermal energy by irradiation of each bonding portion of each connection pad and the corresponding probe.
Claims13
A method of producing a probe assembly which uses thermal energy of a laser light for bonding a plurality of connection pads provided on a probe board and a probe to be disposed on each connection pad, characterized by forming a dummy connection pad with no probe adhered in the neighborhood of at least one of the connection pads on the probe board in order to uniform the thermal energy due to the irradiation of each bonding portion of each connection pad and the corresponding probe with the laser light.
A probe assembly which uses thermal energy of a laser light for bonding a plurality of connection pads provided on a probe board and a probe disposed on each connection pad, wherein a dummy connection pad with no probe adhered is formed in the neighborhood of at least one of the connection pads in order to uniform thermal energy for bonding by irradiation of each connection pad and the corresponding probe with the laser light.
Dependencies are inferred from the claim text.