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AssigneeMicronas GmbH
InventorsMartin Bayer, Hans-Jorg Fink
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In a process for testing the measurement accuracy of at least one magnetic field sensor, in particular during manufacturing, a semiconductor wafer that has at least two semiconductor chips is provided. A measurement coil is integrated into at least one first semiconductor chip, and a magnetic field-sensitive electric circuit is integrated into at least one second semiconductor chip that forms the magnetic field sensor. The first semiconductor chip, of which at least one is present, is positioned at an exciter coil that is supplied with current in order to generate a reference magnetic field. With the aid of the measurement coil a first measured value that is dependent on the magnetic flux density is acquired and the current in the exciter coil is adjusted depending on the first measured value. The second semiconductor chip, of which at least one is present, is positioned at the exciter coil. With the aid of the electronic circuit a second measured value that is dependent on the magnetic flux density is acquired and compared with a reference value range.
A method for testing the measurement accuracy of at least one magnetic field sensor, in particular during manufacturing, in which a semiconductor wafer that has at least two semiconductor chips is provided, and a measurement coil is integrated into at least one first semiconductor chip, and a magnetic field-sensitive electric circuit is integrated into at least one second semiconductor chip that forms the magnetic field sensor, and the first semiconductor chip, of which at least one is present, is positioned at an exciter coil, and the exciter coil is supplied with current in order to generate a reference magnetic field, and with the aid of the measurement coil a first measured value that is dependent on the magnetic flux density is acquired, and the current in the exciter coil is adjusted depending on the first measured value, and the second semiconductor chip, of which at least one is present, is positioned at the exciter coil, and with the aid of the electric circuit a second measured value that is dependent on the magnetic flux density is acquired and compared with a reference value range.
A method to test the measurement accuracy of at least one magnetic field sensor, in particular during manufacturing, in which a semiconductor wafer that has at least two semiconductor chips is provided, and a measurement coil is integrated into at least one first semiconductor chip, and a magnetic field-sensitive electric circuit is integrated into at least one second semiconductor chip forming the magnetic field sensor, and the first semiconductor chip, of which at least one is present, is positioned at the exciter coil, and current is applied to the exciter coil in order to generate a first reference magnetic field, and a first measured value that is dependent on the magnetic flux density is acquired with the aid of the measurement coil, and depending on the first measured value, a reference value range is provided, and a second semiconductor chip, of which at least one is present, is positioned at the exciter coil, and a second measured value that is dependent on the magnetic flux density is acquired with the aid of the electric circuit and is compared with the reference value range.
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