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AssigneeSiemens Medical Solutions USA, Inc.
InventorsDavid A. Petersen, Stephen C. Englund
Estimating the term…
One or more chips, integrated circuits, or semiconductors are embedded within a backing block. Planar sheets of backing material are formed with integrated circuits within holes in the sheets. Traces connect the integrated circuit to electrodes or exposed conductive surfaces. A plurality of the planar sheets may be manufactured using wafer processing, such as pick and place of chips in a wafer of backing material and IC redistribution for forming the traces. The different sheets are cut from the wafer and stacked adjacent each other. The transducer connects with the exposed electrodes or conductive surfaces of the backing.
In an ultrasound transducer having transducer material forming a plurality of elements, electrodes on each of the elements, and an acoustically attenuating backing material, an improvement comprising:
A backing for acoustic attenuation of energy from a backside of a transducer, the backing comprising:
A method for creating a backing for an ultrasound transducer array, the method comprising:
Dependencies are inferred from the claim text.