Slots to reduce electromigration failure in back end of line structure
AssigneeInternational Business Machines Corporation
InventorBaozhen Li
Life of this patent
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Abstract
A back-end of the line (BEOL) structure and method are disclosed. In one embodiment the BEOL structure may include: a copper line in an ultra low-k dielectric, the copper line connected on one end to a cathode via and on another end to an anode via; and a plurality of slots extending laterally along a length of the copper line, the plurality of slots being non-continuous along the length of the copper line, and wherein the plurality of slots reduce electromigration failure in the BEOL structure by enabling copper extrusions to occur along the plurality of slots.
Claims6
A method of reducing electromigration failure in a back end of the line (BEOL) structure, the method comprising:
- forming a copper line in a low-k dielectric, the copper line connected at one end to a cathode via and at another end to an anode via;
- and
- forming a plurality of slots extending laterally along a length of the copper line, the plurality of slots being non-continuous along the length of the copper line, and wherein the plurality of slots reduce electromigration failure in the BEOL structure by enabling copper extrusions to occur along the plurality of slots.
A back-end of the line (BEOL) structure comprising:
- a copper line in a low-k dielectric, the copper line connected at one end to a cathode via and at another end to an anode via;
- and
- a plurality of slots extending laterally along a length of the copper line, the plurality of slots being non-continuous along the length of the copper line, and wherein the plurality of slots reduce electromigration failure in the BEOL structure by enabling copper extrusions to occur along the plurality of slots.
Dependencies are inferred from the claim text.