Lead frame, semiconductor package including the lead frame and method of forming the lead frame

A semiconductor package comprising:

• a semiconductor chip including a plurality of input/output units;
• a die pad on which the semiconductor chip is installed;
• a plurality of first leads spaced apart from the die pad, the plurality of the first leads having a first spaced apart configuration;
• an adhesive member having a first adhesive surface and a second adhesive surface, the plurality of first leads being adhered to one of the first and second adhesive surfaces;
• a plurality of second leads spaced apart from the die pad, the plurality of the second leads having a second spaced apart configuration complementary to the first spaced apart configuration, the plurality of second leads being adhered to the other one of the first and second adhesive surfaces;
• first conductive wires electrically connecting a first portion of the input/output unit to the plurality of first leads;
• second conductive wires electrically connecting a second portion of the input/output unit to the plurality of second leads;
• and
• an encapsulation for surrounding the semiconductor chip.

A method of forming a lead frame for a semiconductor package comprising:

• coupling a first lead frame portion to a first side of a double-sided adhesive member, the first lead frame portion including a plurality of first leads having a first spaced apart configuration;
• aligning with the first lead frame portion a second lead frame portion including a plurality of second leads having a second spaced apart configuration complementary to the first spaced apart configuration;
• and
• coupling the second lead frame portion to a second side of the double-sided adhesive member such that the plurality of first leads and the plurality of second leads are arranged in an alternating, non-overlapping manner.