Image sensor package and fabrication method thereof
AssigneeXintec Inc.
InventorsWen-Cheng Chien, Wang-Ken Huang
Life of this patent
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Abstract
An image sensor package and a method for fabricating thereof are provided. A substrate having an insulator filled cavity is provided with an image sensor device electrical connected to a metal layer, thereon. A covering plate is then disposed on the substrate. The substrate is subsequently thinned to expose the insulator. Removing a portion of the insulator, a hole is formed and a conductive layer is filled therein to form a via hole. Next, a solder ball is located over a backside of the substrate which is electrically connected to the metal layer through the via hole. The image sensor package is thinned, thus, the dimensions thereof are reduced.
Claims18
A method for fabricating an image sensor package, comprising:
- providing a substrate having a cavity filled with an insulator therein;
- forming an image sensor device and a metal layer on a frontside of the substrate;
- disposing a covering plate on the substrate;
- thinning the substrate to expose the insulator;
- removing a portion of the insulator to form a hole;
- forming a conductive layer on a backside of the substrate and extended to the hole to form a via hole;
- and
- disposing a solder ball on the conductive layer and electrically connected to the metal layer.
An image sensor package, comprising:
- a substrate having a via hole therein;
- an image sensor device formed on a frontside of the substrate;
- a metal layer formed on the frontside of the substrate and electrically connected to the image sensor device;
- a covering plate disposed on the substrate;
- a conductive layer formed a backside of the substrate;
- and
- a solder ball disposed on the conductive layer and electrically connected to the metal layer.
Dependencies are inferred from the claim text.