Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member
AssigneesHitachi Kokusai Electric Inc., Teitokusha Co., Ltd.
InventorsAkira Hayashida, Masaaki Ueno, Masakazu Shimada, Kimio Kitamura, Kenji Tanaka, Jyunichi Nishihara
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