Sputter-enhanced evaporative deposition apparatus and method
AssigneeRaytheon Company
InventorsDaniel B. Mitchell, Geoffrey G. Harris
Life of this patent
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Abstract
A deposition apparatus includes a deposition source that produces a deposition flow of a deposited material and has an evaporation source with a material to be deposited therein, and a sputtering source that produces sputtering ions directed at the material to be deposited in the evaporation source. A deposition target is in facing relationship to the deposition source. The sputtering source is operated simultaneously with the evaporation source.
Claims17
A deposition apparatus operable to deposit a material to be deposited on a deposition target, the deposition apparatus comprising:
- a deposition source that produces a deposition flow of a deposited material, the deposition source comprising:
- an evaporation source that receives therein the material to be deposited, and
- a sputtering source operable to produce sputtering ions directed at the material to be deposited in the evaporation source, while the evaporation source is operated.
A deposition apparatus operable to deposit a material to be deposited, the deposition apparatus comprising:
- a deposition source that produces a deposition flow of a deposited material, the deposition source comprising:
- an evaporation source that receives therein the material to be deposited, and
- a sputtering source that produces sputtering ions directed at the material to be deposited in the evaporation source while the evaporation source is operated;
- a deposition target in facing relationship to the deposition source;
- an adjustable evaporation power source for the evaporation source;
- an adjustable sputtering power source for the sputtering source, wherein the adjustable evaporation power source and the adjustable sputtering power source are adjustable independently of each other;
- a vacuum enclosure having an interior in which the deposition source and the deposition target are received;
- and
- a vacuum pump operable to evacuate the interior of the vacuum enclosure.
A method for depositing a material on a deposition target, comprising the steps of
- providing a deposition source that contains a material to be deposited and produces therefrom a deposition flow of the material to be deposited, the deposition source comprising:
- an evaporation source having therein the material to be deposited, and
- a sputtering source that produces sputtering ions;
- providing a deposition target in facing relationship to the deposition source;
- operating the evaporation source to evaporate the deposited material;
- and simultaneously
- operating the sputtering source to sputter ions of the material to be deposited from the evaporation source so as to deposit upon the deposition target.
Dependencies are inferred from the claim text.