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US 2009/0014160 A1Published application
Heat dissipation module
AssigneeASUSTeK COMPUTER INC.
InventorMing-Yang Hsiao
Life of this patent
Estimating the term…
Abstract
A heat dissipation module including a fan and a first heat dissipation unit is provided. The fan has a frame and a blade set provided in the frame. The frame has an air inlet and an air outlet, and a flow channel communicating the air inlet and the air outlet is formed between the blade set and the frame. The first heat dissipation unit includes a first heat dissipation base, a first radiating fin assembly located inside the frame wall of the fan on the flow channel, and a first heat pipe which is connected between the first heat dissipation base and the first radiating fin assembly.
Claims9
A heat dissipation module comprising:
- a fan having a frame and a blade set provided in the frame, wherein the frame has an air inlet and an air outlet, a flow channel is formed between the frame and the blade set and is communicated with the air inlet and the air outlet, and the blade set is suitable to impel the airflow to flow into the flow channel from the air inlet and to flow out from the air outlet;
- and
- a first heat dissipation unit having a first heat dissipation base, a first radiating fin assembly located inside the frame wall of the fan on the flow channel, and a first heat pipe including a first end and a second end, wherein the first end is connected to the first heat dissipation base, and the second end is connected to the first radiating fin assembly.
Dependencies are inferred from the claim text.