Substrates and methods of using those substrates

A method of removing contamination from a fluid at least partly contained by an apparatus used in lithography, the method comprising:

• loading a substrate into the apparatus, the substrate comprising a series of protrusions or recesses, the series of protrusions or recesses being wetting or anti-wetting with respect to the fluid to promote the transfer of contamination from the fluid to the cleaning substrate;
• bringing the substrate into proximity with the fluid from which contamination is to be removed, such that contamination is removed from the fluid and deposited onto the protrusions or into the recesses;
• and
• unloading the substrate from the apparatus.

A method of removing contamination from an apparatus used in lithography, the method comprising:

• loading a substrate into the apparatus to attract contamination onto the substrate, the substrate comprising a first region and a second region configured to attract contamination, the second region having a different polarity or electrical charge to the first region, the first and second regions each being one of:
• polar and positively charged,
• polar and negatively charged,
• a polar and positively charged, or
• a polar and negatively charged;
• and
• unloading the substrate from the apparatus.

A substrate suitable to remove contamination from an apparatus used in lithography, the substrate dimensioned so as to be suitable for handling by the lithographic apparatus, the substrate comprising:

• a first region and a second region configured to attract contamination, the second region having a different polarity or electrical charge to the first region, the first and second regions each being one of:
• polar and positively charged,
• polar and negatively charged,
• a polar and positively charged, or
• a polar and negatively charged.

A method of removing contamination from an apparatus used in lithography, the method comprising:

• loading a first substrate into the apparatus to attract contamination onto the first substrate, the first substrate comprising a region configured to attract contamination and being one of:
• polar and positively charged,
• polar and negatively charged,
• a polar and positively charged, or
• a polar and negatively charged;
• unloading the first substrate from the apparatus;
• loading a second substrate into the apparatus to attract contamination onto the second substrate, the second substrate comprising a region configured to attract contamination and having a different polarity or electrical charge to the region of the first substrate, and being one of:
• polar and positively charged,
• polar and negatively charged,
• a polar and positively charged, or
• a polar and negatively charged;
• and
• unloading the second substrate from the apparatus.