Heat treatment apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsTae-gyu Kim, Dong-Woo Lee, Jin-Sung Lee, Tae-Sang Park, Bang-Weon Lee
Life of this patent
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Abstract
Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
Claims5
A cooling method of a heat treatment apparatus, which includes a cooling chamber under a heating plate and cools down the heating plate by injecting liquid droplet aerosol that is formed by mixing a cooling liquid and a gas into the cooling chamber, the method comprising:
- cooling the heating plate by continuously injecting the liquid droplet aerosol into the cooling chamber for a predetermined period;
- and
- removing vapor remaining in the cooling chamber by injecting only the gas into the cooling chamber.
A cooling method of a heat treatment apparatus, which includes a cooling chamber under a heating plate and cools down the heating plate by injecting liquid droplet aerosol that is formed by mixing a cooling liquid and a gas into the cooling chamber, the method comprising:
- cooling the heating plate by injecting the liquid droplet aerosol in a pulse form into the cooling chamber for a predetermined period;
- and
- removing vapor remaining in the cooling chamber by injecting only the gas into the cooling chamber.
Dependencies are inferred from the claim text.