Computer-implemented methods, carrier media, and systems for detecting defects on a wafer based on multi-core architecture

(canceled)

A carrier medium, comprising program instructions executable on a computer system for performing a computer-implemented method for detecting defects on a wafer, wherein the computer-implemented method comprises:

• acquiring output for the wafer generated by an inspection system, wherein dies are formed n the wafer, wherein multiple cores are formed in the dies, wherein the multiple cores have a period in the dies greater than a period of repetitive patterned features formed in the dies;
• and
• detecting defects on the wafer by comparing the output for a first of the multiple cores to the output for a second of the multiple cores, wherein the first and second of the multiple cores are formed in the same die, different dies, or the same die and different dies.

A system configured to detect defects on a wafer, comprising:

• an inspection system configured to generate output for the wafer, wherein dies are formed on the wafer, wherein multiple cores are formed in the dies, and wherein the multiple cores have a period in the dies greater than a period of repetitive patterned features formed in the dies;
• and
• a computer system configured to detect defects on the wafer by comparing the output for a first of the multiple cores to the output for a second of the multiple cores, wherein the first and second of the multiple cores are formed in the same die, different dies, or the same die and different dies.