US 2008/0305579 A1 · Method for fabricating semiconductor device installed with passive components

Abstract

A method for fabricating a semiconductor device installed with passive components is provided. The method includes: having at least a passive component make a bridge connection between a ground circuit and a power circuit of each of a plurality of substrate units; electrically connecting a conductive circuit on a cutting path between substrate units to the ground circuit and the power circuit, and forming a short circuit loop; or electrically connecting the conductive circuit on the cutting path between the substrate units to the power circuit and the ground circuit via bonding wires, and forming a short circuit loop; or applying a wire bonding machine to form a stud bump on the power circuit, and then forming a short circuit loop via the power circuit and ground loop of the wire bonding machine; therefore, via the short circuit loop, the passive component is capable of releasing electricity filled therein from previous plasma clean process of substrate units and chips; and grounding the chips and the substrate units and electrically connecting powers and signals to prevent the chips from being damaged due to sudden current impulses resulting from the discharging of the passive components when the passive components are electrically connected to the chips.

Claims24

Dependent claims

A method for fabricating a semiconductor device installed with passive components, comprising:

providing a substrate modular board with a plurality of substrate units, the substrate units being demarcated by a plurality of cutting paths, the substrate units each having a chip-bonding zone, a ground circuit, and a power circuit, and the cutting paths each having a conductive circuit, wherein the conductive circuit is electrically connected to the ground circuit and the power circuit to form a short circuit loop;
disposing at least a passive component on each of the substrate units, and electrically connecting the passive component to the ground circuit and the power circuit;
disposing a chip with a plurality of bonding pads at the chip-bonding zone of each of the substrate units;
connecting electrically the bonding pads of the chip to the ground circuit and the power circuit via bonding wires;
connecting electrically the bonding pads not connected to either the ground circuit or the power circuit on the chip to the substrate unit via bonding wires;
and
performing an encapsulation process and cutting apart the substrate units from one another so as to remove the conductive circuits from the cutting paths.

4 more elements

A method for fabricating a semiconductor device installed with passive component, comprising:

providing a substrate modular board having a plurality of substrate units, the substrate units being demarcated by a plurality of cutting paths, and the substrate units with each having a chip-bonding zone, a ground circuit, and a power circuit disposed thereon;
and the cutting paths with each having a conductive circuit disposed thereon;
disposing at least a passive component on each of the substrate units, and then electrically connecting the passive component to the ground circuit and the power circuit of the substrate unit;
disposing a chip having a plurality of bonding pads on the chip-bonding zone;
electrically connecting the conductive circuit to the ground circuit and the power circuit via bonding wires, and consequently form a short circuit loop;
electrically connecting corresponding bonding pads of the chip to the ground circuit and the power circuit via bonding wires;
electrically connecting the bonding pads not connected to either the ground circuit or the power circuit on the chip to the substrate unit via bonding wires;
and
proceeding to a packaging process and cutting apart each of the substrate units from one another, and then removing conductive circuits from the cutting paths.

6 more elements

A method for fabricating a semiconductor device having passive component, comprising:

providing a substrate unit having a chip-bonding zone, a ground circuit, and a power circuit disposed thereon;
disposing at least a passive component on the substrate unit, and then electrically connecting the passive component to the ground circuit and the power circuit;
and disposing a chip having a plurality of bonding pads on the chip-bonding zone;
applying a wire bonding machine to form a stud bump on the power circuit, and consequently having the power circuit contact with a ground loop of the wire bonding machine to form an electricity discharging loop;
electrically connecting corresponding bonding pads of the chip to the ground circuit and the power circuit via bonding wires;
and
electrically connecting the bonding pads not connected to either the ground circuit or the power circuit on the chip to the substrate unit via bonding wires.

4 more elements

Dependencies are inferred from the claim text.

Method for fabricating semiconductor device installed with passive components

Life of this patent

Method for fabricating semiconductor device installed with passive components

Life of this patent

Abstract

Claims24