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US 2008/0305428 A1Published application
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer
AssigneeInfineon Technologies AG
InventorsWerner Kroninger, Manfred Schneegans
Life of this patent
Estimating the term…
Abstract
A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.
Claims15
1-29. (canceled)
An adhesive piece, comprising
- an adhesive layer having an adhesive force that changes during an irradiation,
- a first outer layer being arranged on one side of the adhesive layer and adheres to the adhesive layer with an adhesion force of less than 2 N/20;
- and
- a second outer layer being arranged on the other side of the adhesive layer, said second outer layer adhering to the adhesive layer with an adhesion force of less than 2 N/20 mm.
1 more element
A resist layer comprising:
- a solid material being suitable for a selective development and exposure for fabricating an integrated circuit arrangement, wherein the resist layer is arranged such that it is freely movable on a carrier which can be stripped from the resist layer without damage to the resist layer.
43-44. (canceled)
Dependencies are inferred from the claim text.