System and method for thermal analysis using variable thermal resistance
AssigneeWaters Investments Limited
InventorRobert L. Danley
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AssigneeWaters Investments Limited
InventorRobert L. Danley
Estimating the term…
A thermal measurement apparatus and method for performing heat flux differential scanning calorimetry (DSC) is disclosed. A variable thermal resistor is used to couple a measurement assembly to a heat sink in the thermal measurement apparatus, such that samples can be rapidly heated and rapidly cooled. The apparatus can be configured with a highly conductive sample assembly enclosure. The enclosure can include a high emissivity coating. In one embodiment, the enclosure extends along a longitudinal direction that is about the same as that of an infrared lamp assembly used to heat the enclosure, thereby increasing the efficiency of heating the sample enclosure. In one configuration, the variable thermal resistor comprises a gap whose gas composition can be varied during a sample measurement to independently optimize sample heating and cooling rates.
A thermal measurement system, comprising:
A thermal measurement system configured to perform heat flux differential scanning calorimetry, comprising;
A method for performing thermal analysis, comprising:
A thermal measurement system, comprising:
A method of thermal analysis during rapid thermal processing, comprising:
Dependencies are inferred from the claim text.